CVE-2025-27060
HighCVSS 8.8Exploitation Probability (EPSS)
Low risk0th percentile - higher than 0% of all known CVEs
Summary
The vulnerability causes memory corruption while performing SCM call with malformed inputs.
Risk Assessment
An attacker could exploit this vulnerability to escalate privileges or compromise system security.
Recommendation
Install security patches and validate inputs before SCM calls.
Other vulnerabilities in Qualcomm
See all- CVE-2026-25294High
Transient DOS while parsing frame during channel usage.
- CVE-2026-25290High
Memory Corruption when validating large data buffers from external sources using addition to check buffer length.
- CVE-2026-25284High
Information Disclosure when a pointer is reused after being deallocated.
- CVE-2026-25283High
Memory Corruption when copying unverified data from an external source exceeds the allocated buffer size.
- CVE-2026-25282High
Transient DOS when processing unverified data from a neighboring system causes out of bound memory access.
- CVE-2026-25281High
Transient DOS when processing large or numerous request buffers without sufficient memory allocation validation.
- CVE-2026-25280High
Memory corruption when processing escape handling flow with insufficient user buffer sizes.
- CVE-2026-25278High
Memory Corruption when processing I2C transfer requests due to a race condition between memory allocation and data copying.
- CVE-2026-24090High
Cryptographic issue while processing partition table entries allows unauthorized modification of boot flow.
- CVE-2025-47396High
Memory corruption occurs when a secure application is launched on a device with insufficient memory.
Original NVD description (English source)
Memory corruption while performing SCM call with malformed inputs.
Vulnerability data from NVD (NIST) · CISA KEV · EPSS