CVE Catalog

Actively exploited in the wild

Qualcomm Multiple Chipsets Use-After-Free Vulnerability

Qualcomm - Multiple Chipsets · Listed in the CISA KEV since 2023-12-05. This indicates confirmed attacks in production environments.

Required action: Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.

CVE-2023-33063

HighCVSS 7.8KEV
Published: Updated: Translated: NVD NIST

Summary

Memory corruption in DSP Services occurs during a remote call from HLOS to DSP. It may lead to unintended memory modification.

Risk Assessment

Could allow an attacker to destabilize the system or execute malicious code.

Recommendation

Update DSP software and related components to the version containing the fix.

Related vulnerabilities

Original NVD description (English source)

Memory corruption in DSP Services during a remote call from HLOS to DSP.

Vulnerability data from NVD (NIST) · CISA KEV · EPSS