CVE Catalog

CVE-2016-2063

High
Published: Translated: NVD NIST

Summary

A stack-based buffer overflow exists in the supply_lm_input_write function in the MSM Thermal driver for Linux kernel 3.x. Attackers can exploit this vulnerability by sending a large amount of data through the debugfs interface, potentially leading to denial of service or unspecified other impacts.

Risk Assessment

This vulnerability can cause significant disruptions in system operation, affecting service availability within the organization. There is a risk that attackers may exploit this flaw to carry out denial of service attacks.

Recommendation

It is recommended to update the Linux kernel to the latest version to mitigate this vulnerability. Additionally, monitoring traffic through the debugfs interface and restricting access to it can help minimize the risk of an attack.

Related vulnerabilities

Original NVD description (English source)

Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.

Vulnerability data from NVD (NIST) · CISA KEV · EPSS